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  • Diamond particles in a resin bond matrix offer high cut rates in wet or dry grinding applications on materials such as carbides, ceramics and non-ferrous metals
Unit of Measure

Specifications

D x T x H

 N/A 10" x 1/2" x 3"

Quanity Per Case

 N/A 1

Specification

 N/A CGD150 R75 PS X=1/4